DIFFUSION BONDING USING TAGUCHI METHOD.

Abstract

The present study includes characterization of diffusion bonding of aluminum alloy 2024-O without and with
applying different interlayers as pure powder such as copper, silver and titanium. Bonding was performed in
vacuum up to (1×10-5 mbar) using vacuum system bonding. Aluminum alloy 2024-O specimens was used as
cylinder shape as diameter (15mm) and (35mm) length and interlayer thickness was equal 100 ϻm, under
bonding conditions of (330-480°C) and (1-4 Mpa) and duration of (60 min). Interlayer was classified according
to diffusion coefficient of each element in the base alloy.TaguchiMethod was applied to reduce the number of
experiments and determine the optimum bonding conditions. Optimum bonding conditions were (430 °C) and (4
Mpa) during (60 min) time as bonding and the best interlayer used was copper powder. Tensile testing of
bonded joint was performance for the specimen at optimum bonding condition. The ultimate strength was found
equal 189.2 Mpa with an efficiency of 91.8 % compared to the ultimate strength of aluminum alloy 2024-
O.Minitab 17 program gave the accuracy of the model according to relationship between every factor and tensile
strength by scatter plots to determine the accuracy of model. The accuracy of model is 99.13 % this mean that
the model is perfect. Minitab 17 program gave A statistical model equation that represent the final model
equationthat was deduced using Minitab 17 which gives the effect of all variables (temperature, pressure and
interlayer) on the bonding strength of the joint