COPPER SEEDS FOR HIGH QUALITY ELECTRODEPOSITION OF COBALT-RICH ALLOYS NANOSTRUCTURES ON SILICON

Abstract

We report the electrodeposition (ED) of cobalt-rich alloy films on n-type Si (100) substrates in aqueous solution. A small amount of copper sulfate in the bath improved the quality of cobalt-richfilms. The bath proved to be appropriate for the production of electrodeposited magnetic antidot structures prepared by nanosphere lithography (NSL) technique. X-ray measurements indicate a mixture of hcp and fccCoCu structures and firm texture in the (001) hcp and (111) fcc direction. Magnetic behavior was shown to be dependent on the thickness, which directly affects the domain wall pinning and the presence of superparamagnetism.